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 ICs for MD System
AN22011A
3-beam MD system pre-amplifier
Overview
The AN22011A incorporates such functions as RF signal processing, servo signal processing, ADIP signal processing and laser control. This is an RF IC that can constitute the MD system using 3-beam pick-up in combination with the digital signal processing LSI MN66621. The IC allows us to achieve a considerable low power dissipation as well as its low supply voltage operation (VCC = 2.1 V to 3.6 V) due to our introduction of digital matrix (PD = 11 mW at VCC = 2.1 V). The IC can be used in a wide range of applications from a stand-alone system to a portable system.
36 9.000.20 7.000.10 25
Unit: mm
(0.75) 13 0.50 0.10 M (1.00)
0.150.05
37
24
48
(0.75)
0.10
Features
* 3-beam system pick-up * RF signal processing * Servo signal processing * Laser power control function * Low supply voltage operation (2.1 V to 3.6 V) * Ultra low power consumption (min. 11 mW) * Thin package adopted (Mold thickness: 1 mm)
Seating plane 0 to 8 0.500.10
TQFP048-P-0707B (Lead-free package)
Applications
* MD player/recorder * Home audio systems/mini systems * Portable audio * Car audio
0.10+0.10 -0.05
(1.00) 1.20 max.
1
12 0.200.05
7.000.10 9.000.20
Publication date: June 2002
SDD00024AEB
1
AN22011A
Block Diagram
2
Microcomputer Servo LSI GND2 36
LDON MONIOFF NRFSTBY CLV2
Thermistor resistance 35 Switch x 1 BPF x 2 BPF 22 VREF 21 VREF VCC VREF
VREF
34
33
32
31
30
29
28
27
26
25 24 23
Pickup VREF 3 tap 3 tap
VREF
37 Switching signal
CLV2
PD 3 tap
A
38 VREF
PD
B
39
PD 20 3 tap
VREF
C
40
PD
D
41
VREF
42
19 18 Band gap 17 MONIOFF 3 tap AGC 3 tap 3Tenv Bottom detector EQ Peak detector 14 13 16 15
VREF VCC
PD SW NRFSTBY
SDD00024AEB
IV
43
RF2
PD
IV
44
RF1
45 VREF VREF
LDON
46
PD
F
47
VCC
PD 1 2 LPF 3 4 5 6
E
48
7
8
9
10
11
12
Pickup
PD
GND1
Laser
AN22011A
Pin Descriptions
Pin No. Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 LDO LDIN Description LD amplifier output pin LD amplifier reverse input pin 27 28 NREC Pin No. Symbol 26 Description OFSON Te stray light canceling operation setting pin Rec/playback switching signal input pin
APCPD Photo diode light quantity detector pin APCREF APC amplifier reference voltage input pin ARFO N.C. EQIN RF amplifier output pin EQ input pin
RFSWHL Reflection ratio H/L switching signal input pin
29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48
RFSWPG Pit/Grv switching signal input pin GND2 N.C. GND pin 2
CRFAGC RFAGC capacitor pin OUTRF EFM output pin N.C. PEAK GND1 BOTM CEA EFM bright level detection output pin GND pin 1 EFM dark level detection output pin 3T envelope detection capacitor pin
MONIOFF 3TMON circuit control signal input pin CLV2 LDON ADIP BPF switching signal input pin APC circuit control signal input pin
NRFSTBY Standby control signal input pin TEMP Temperature sensor amplifier output pin
TEMPIN Temperature sensor amplifier input pin A B C D VREF RF2 RF1 N.C. N.C. F E A signal input pin B signal input pin C signal input pin D signal input pin Reference signal output pin RF2 signal input pin RF1 signal input pin F signal input pin E signal input pin
MON3T 3T envelope output pin EE FF VCC OFSIN N.C. FF2 FF1 N.C. N.C. ADIP E signal I-V converting output pin F signal I-V converting output pin VCC pin Te stray light canceling pin (A + C) signal I-V converting output pin (B + D) signal I-V converting output pin ADIP signal output pin
Absolute Maximum Ratings
Parameter Supply voltage Supply current Setting pin upper limit Power dissipation
*1 *1 *2
Symbol VCC ICC VINH PD Topr Tstg
Rating 4.0 7.5 3.6 30 -30 to +85 -55 to +125
Unit V mA V mW C C
Operating ambient temperature Storage temperature
*1
Note) *1: Except for power dissipation, operating ambient temperature and storage temperature, all ratings are for Ta = 25C. *2: Setting pin refers to OFSON (pin 26), NREC (pin 27), RFSWHL (pin 28), RFSWPG (pin 29), MONIOFF (pin 32), CLV2 (pin 33), LDON (pin 34), NRFSTBY (pin 35).
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3
AN22011A
Recommended Operating Range
Parameter Supply voltage Symbol VCC Range 2.1 to 3.6 Unit V
Electrical Characteristics at Ta = 25C
Parameter No load consumption current 1 No load consumption current 2 VREF offset VREF output impedance LD amplifier OFF operation LD amplifier gain playback mode LD amplifier gain recording mode Temperature amplifier gain FF1 offset FF2 offset FF1 gain pit high reflection ratio mode FF1 gain pit low reflection ratio mode FF1 gain record mode FF2 relative gain pit high reflection ratio mode FF2 relative gain pit low reflection ratio mode FF2 relative gain record mode FF1 frequency characteristic FF2 frequency characteristic EE offset FF offset EE gain pit high reflection ratio mode EE gain pit low reflection ratio mode EE gain record mode FF relative gain pit high reflection ratio mode FF relative gain pit low reflection ratio mode Symbol ITOTAL1 ITOTAL2 VOVB ZVB VLDOFF GLDP GLDR GTM VF1 VF2 ZFIRO ZFIRA ZFIRE ZF2RO ZF2RA ZF2RE GF1 GF2 VEE VFF ZEERO ZEERA ZEERE ZFFRO ZFFRA Conditions Normal mode Sleep mode Normal mode I42 = 1.5 mA APC OFF mode APC ON mode APC ON mode V37 = VREF 0.75 V Pit high reflection ratio mode Pit high reflection ratio mode Pit high reflection ratio mode Pit low reflection ratio mode Record mode Pit high reflection ratio mode Pit low reflection ratio mode Record mode Pit high reflection ratio mode V38: 3 kHz, 30 kHz Sine wave Pit high reflection ratio mode V39: 3 kHz, 30 kHz Sine wave Pit high reflection ratio mode Pit high reflection ratio mode Pit high reflection ratio mode Pit low reflection ratio mode Record mode Pit high reflection ratio mode Pit low reflection ratio mode Min 4.5 200 -50 -23 -5.5 -2 -100 -100 46.2 197 17.5 -2 -2 -2 -9 -9 -750 -750 148 776 88 -2 -2 Typ 5.5 300 0 -20 -2.5 0 0 0 57.7 250 21.9 0 0 0 -6 -6 -600 -600 185 970 110 0 0 Max 6.5 400 50 5 0.2 -17 0.5 2 100 100 69.2 303 26.3 2 2 2 -3 -3 -450 -450 222 1 164 132 2 2 Unit mA A mV V dB dB dB mV mV k k k dB dB dB dB dB mV mV k k k dB dB
4
SDD00024AEB
AN22011A
Electrical Characteristics at Ta = 25C (continued)
Parameter FF relative gain record mode EE frequency characteristics FF frequency characteristics Te stray light canceling operation ADIP gain ADIP center frequency ADIP band width ADIP relative gain typical speed mode RF amplifier gain groove mode RF amplifier gain pit low reflection ratio mode RF amplifier gain pit high reflection ratio mode Symbol ZFFRE GEE GFF TOFS GAD1 FAD1 FAD1 GAD2 GRFG GRFPL GRFPH Conditions Record mode Pit high reflection ratio mode V48: 1.5 kHz, 15 kHz Sine wave Pit high reflection ratio mode V47: 1.5 kHz, 15 kHz Sine wave Ram mode Stray light canceling mode Record mode Line double speed mode Record mode Line double speed mode Record mode Line double speed mode Record mode Typical speed mode V43: 100 kHz Sine wave Groove mode V43: 100 kHz Sine wave Pit low reflection ratio mode V43: 100 kHz Sine wave Pit high reflection ratio mode V43: 5 MHz Sine wave Groove mode V43: 5 MHz Sine wave Pit low reflection ratio mode V43: 5 MHz Sine wave Pit high reflection ratio mode V7: 400 kHz, 1.44 MHz Sine wave V8 = VREF V7: 500 kHz Sine wave V7: sin 500 mV[p-p], 720 kHz V8 = VREF V7 = VREF, V8 = VREF V7 = VREF V7: 720 kHz AM modulation Sine wave (1 kHz, 30%) V7 = VREF Min -2 -6 -6 0.4 24.0 35.2 23.7 -3 19 3 -11.5 -3 -3 -3 2.5 0.4 -140 0.1 -200 80 -200 -20 125 Typ 0 -3 -3 0.5 27.0 44.0 29.6 0 22 6 -8.5 3.5 0.5 -110 0.4 0 110 0 0 185 Max 2 - 0.5 - 0.5 0.6 30.0 52.8 35.5 3 25 9 -5.5 4.5 0.6 -80 0.7 200 Unit dB dB dB dB kHz kHz dB dB dB dB dB dB dB dB V[p-p] A A mV
RF amplifier frequency characteristics GRFG groove mode RF amplifier frequency characteristics GRFPL pit low reflection ratio mode RF amplifier frequency characteristics GRFPH pit high reflection ratio mode EQ boost gain AGC operation AGC discharge current AGC charging current EFM Peak peak detecting offset EFM Peak peak detecting level EFM bottom detecting offset GEQ VOMRFV IAGC1 IAGC2 VPE VPEAK VBO
140 mV[p-p] 200 20 mV mV[p-p]
EFM bottom detecting relative level VBOTM V7: 720 kHz AM modulation Sine wave (1 kHz, 30%) 3T element envelope extracting level V3TMON V7: 720 kHz AM modulation Sine wave (5 kHz, 5%)
245 mV[p-p]
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5
AN22011A
Usage Notes
1. Operation mode setting * Gain switch setting NREC (Pin27) H H H L RFSWHL (Pin28) RFSWPG (Pin29) H L L L H H L L Operation mode Pit high reflection ratio mode Pit low reflection ratio mode Groove mode Record mode
* 3T detection circuit mode switch setting MONIOFF (Pin32) H L Operation mode 3T detection circuit off 3T detection circuit on
* ADIP BPF mode switch setting CLV2 (Pin33) H L Operation mode Typical speed mode Line double speed mode BPF center frequency fO = 22.0 kHz fO = 44.0 kHz
Note) The values shown on the list are for design purpose.
* APC mode setting LDON (Pin34) H L Operation mode APC circuit on APC circuit off
* Power saving mode setting NRFSTBY (Pin35) H L Operation mode Normal operation Power saving operation
* Te stray light cancellation setting OFSON (Pin26) H L Operation mode Cancellation circuit on Cancellation circuit off
Note) This function is valid only for reading on the writable disk.
6
SDD00024AEB
AN22011A
Usage Notes (continued)
2. Setting pin input voltage Set the input voltages for OFSON (Pin26), NREC (Pin27), RFSWHL (Pin28), RFSWPG (Pin29), MONIOFF (Pin32), CLV2 (Pin33), LDON (Pin34) and NRFSTBY (Pin35). As listed below. Setting H L Input voltage 1.4 V to 3.6 V 0.7 V or less
The related equivalent circuits are as follows.
OFSON 160 k 33 k NREC RFSWHL RFSWPG CLV2 MONIOFF
22.8 k
100 k
NRFSTBY 60 k 60 k
LDON 33 k
200 k
1 k 140 k 140 k 100 k
Note) The resistance values are for designing.
SDD00024AEB
7
Request for your special attention and precautions in using the technical information and semiconductors described in this book
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this book and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this book is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this book. (4) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2002 MAY


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